Hello. I have decided to buy CaseMate Tough case but i wonder if it heats up my phone because of using 2 layer for protection. Anyone having this case can tell me about it? Thanks.
I am using this case and have not experienced any heating issues. I live in England however, so your experience might be different depending on the ambient temperature your end.
i live in Israel and now its summer here, around 30-35 Celsius and even after sometime of using it you don't really feel the warmth so i think its a legit standard.
only once i experienced something like that, when i tried to see how fast it is and got like 6 webpages, played a game and WiFi working along other apps(obviously nothing slowed down-great phone!).
so no, its good to use, and is doing a great job protecting your phone(I'm quite a phone destroyer)
I own the case as well and would stronly argue against charging and doing intensive stuff on the phone at the same time. You don't really notice how hot it might become, because the double-layer protection very well isolates the heat. That doesn't mean it's actually as cold as it feels. Try charging, running something with high cpu/gpu load and touch the upper part, e.g. the camera.
Besides, I am no an heavily undervolted device, stock SG2's might even become hotter. Could this be a reason for the Case Mate beeing completely sold out in Central Europe?
well i would say you people cant feel that cause of the abs protection skin on the silicone case that you mounted before...2 layer system...take down the abs protection and you will see that the silicone gets warm...
We will not feel the heat because of the case, but what about the phone It isn't very good for the electronic components to get heated up..and if touch case traps all the heat then it might cause issues in the long run..
Do you feel the heat on the screen, or if possible after heavy usage i.e. Wi-Fi, gaming etc, can you remove and cover and see if the phone's body is hot? I believe this will give a far idea about the cover. And in India tough case is yet to be seen..its only barely there that sells..
Just worry about how the device going to dissipate the heat in such thick casing.
Yeah definitively the dissipation is worst, but you can feel the heat from the phone. I mean the two covers just add a bit less than 2 mm to the phone (just looking at it, I don't have anything to measure precisely) ...
In my opinion it is better because you don't burn yourself!! And you may still touch the outer edges of the camera to have a precise knowledge of how hot your phone is... =)
LG G4 Heatsink mod
Hello
My lg g4 gets hot after taking like 50 photos in a row. I was using it pretty hard when i was on vacation as my "take-photo-device". After a lot of google searching, i found out that the G3 could have been modified internally to make the temps better and make sure the phone wasnt downclocking as much.
Is there a similar process that you can do on the G4?
Thanks for any help.
here....from Taiwan site....use google Translate if you don't understand it
http://www.mobile01.com/topicdetail.php?f=581&t=4532831
It requires you to remove the original shield, insert a copper plate on the CPU, add some thermal paste and the heat dissipation is better. This way the heat goes out the back cover instead of towards the front as well.
How easy is it to remove that plate.
There is a thermal mod in the works that could come closer to this with less effort but it needs root. Will be interesting to see cpu-z temps grabs with that mod and compare with this one.
One Twelve said:
It requires you to remove the original shield, insert a copper plate on the CPU, add some thermal paste and the heat dissipation is better. This way the heat goes out the back cover instead of towards the front as well.
How easy is it to remove that plate.
There is a thermal mod in the works that could come closer to this with less effort but it needs root. Will be interesting to see cpu-z temps grabs with that mod and compare with this one.
Click to expand...
Click to collapse
problems with thermal mods is that they dont fix the underlying issue (which is the CPU getting hot and downclocking like mad), they just either up the temperature range or downclock the cpu from the start not allowing it to work.
I looked at the taiwan link, however i havent managed to figure it out. Can you use some alluminium foil rather than a copper plate?
One Twelve said:
How easy is it to remove that plate..
Click to expand...
Click to collapse
Easy as. Just flick it up with a knife or screwdriver. Its only held in there with teeny metal grips.
Ashdrake said:
Hello
My lg g4 gets hot after taking like 50 photos in a row. I was using it pretty hard when i was on vacation as my "take-photo-device". After a lot of google searching, i found out that the G3 could have been modified internally to make the temps better and make sure the phone wasnt downclocking as much.
Is there a similar process that you can do on the G4?
Thanks for any help.
Click to expand...
Click to collapse
I did a write up in the sprint threads with pics how i tore mine down and used arctic silver therm paste.
https://forum.xda-developers.com/sprint-g4/general/disassemble4-g4-testin-harware-cooling-t3327640
I recall reading on forums that someone did a LG G4 Thermal Compound mod, did it help with the temperatures? Does anyone have a link to the youtube video for it? This is the only thing I can find when searching:
http://imgur.com/a/P5BtT
Interesting. Looks pretty straight forward, though I wonder about the difference in thickness between thermal tape and grease, I think it would be pretty easy to do. Although, you'd have to replace the thermal pad if the grease wasn't as effective
The Snapdragon CPU is underneath the tape they put on. It doesn't conduct heat very well.
I bought some Alphacool Eisschicht 0.5mm 14W/mK thermal pads, and cut out a square for the CPU. It seems to have significantly reduced the amount of heat I can feel when doing demanding things.
I think it's also responsible for an increased score in Antutu, due to less throttling (I just got a score of 50834, up from around 46-47k)
Is this a joke? How is putting thermal paste onto EM-Shielding going to help dissipate heat?! If anything, it'll isolate and therefore the phone won't "feel" that warm anymore but may infact operate warmer than ususal due to it. Thermal compounds are meant to be used to "conduct" heat to a heatsink by, and this is important, filling out irregularities on the heat source's and heatsink's surface. Without it, the irregularities are filled with air and we all know air is not goog at conducting kinetic energy. Thermal compound has no cooling properties!
Knowbody42 said:
(...) I think it's also responsible for an increased score in Antutu, due to less throttling (I just got a score of 50834, up from around 46-47k)
Click to expand...
Click to collapse
That's what I usually get. A difference of a couple thousand points has little to no significance.
nitrous² said:
Is this a joke? How is putting thermal paste onto EM-Shielding going to help dissipate heat?! If anything, it'll isolate and therefore the phone won't "feel" that warm anymore but may infact operate warmer than ususal due to it. Thermal compounds are meant to be used to "conduct" heat to a heatsink by, and this is important, filling out irregularities on the heat source's and heatsink's surface. Without it, the irregularities are filled with air and we all know air is not goog at conducting kinetic energy. Thermal compound has no cooling properties!
That's what I usually get. A difference of a couple thousand points has little to no significance.
Click to expand...
Click to collapse
a heatsink is a piece of heat conductive element that has a bigger surface compared to the object it want to dissipate heat from. the EM shield has that bigger surface compared to the processor so it's a candidate for heatsink. the thermal compound is used to transfer the heat from the processor to the heatsink. in the theory the mod is solid.
Almighty1 said:
I recall reading on forums that someone did a LG G4 Thermal Compound mod, did it help with the temperatures? Does anyone have a link to the youtube video for it? This is the only thing I can find when searching:
http://imgur.com/a/P5BtT
Click to expand...
Click to collapse
here's the video
https://www.youtube.com/watch?v=QijWruGXqX8
darioampuy said:
a heatsink is a piece of heat conductive element that has a bigger surface compared to the object it want to dissipate heat from. the EM shield has that bigger surface compared to the processor so it's a candidate for heatsink. the thermal compound is used to transfer the heat from the processor to the heatsink. in the theory the mod is solid.
Click to expand...
Click to collapse
Of course, not denying that. Apart from what a heatsink is, you have to know how a heatsink works.
Let's just forget for a second that EM-Shields are not meant to be used as heatsinks. How is putting thermal paste ontop of the EM-Shielding logical in any way? Heat from the IC's on the logic board will dissipate heat to the EM-Shielding. It's going to help a little with cooling, but not significantly. What you do now is, you isolate the EM-Shielding with Thermal compound causing heat to build up even more underneath it. Since you isolated so good, you won't feel the phone heating up so much in your hand. Have you ever built a pc? I do that for a living. It's like putting thermal compound ontop of your heatsink instead of in between CPU and Heatsink. Please look at this majestic MS Paint graphic I just made. I hope it helps to understand how thermal compound works, and is meant to be used. I may not be a professional and I'm asking to be corrected! Seriously. But I'm also positive that OP's method is not how you work with thermal compound.
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nitrous² said:
Of course, not denying that. Apart from what a heatsink is, you have to know how a heatsink works.
Let's just forget for a second that EM-Shields are not meant to be used as heatsinks. How is putting thermal paste ontop of the EM-Shielding logical in any way? Heat from the IC's on the logic board will dissipate heat to the EM-Shielding. It's going to help a little with cooling, but not significantly. What you do now is, you isolate the EM-Shielding with Thermal compound causing heat to build up even more underneath it. Since you isolated so good, you won't feel the phone heating up so much in your hand. Have you ever built a pc? I do that for a living. It's like putting thermal compound ontop of your heatsink instead of in between CPU and Heatsink. Please look at this majestic MS Paint graphic I just made. I hope it helps to understand how thermal compound works, and is meant to be used. I may not be a professional and I'm asking to be corrected! Seriously. But I'm also positive that OP's method is not how you work with thermal compound.
Click to expand...
Click to collapse
KUDOS for the awersome paint skills
i think lg already applied thermal compound between the processor and the em-shield (because it's logic that they transfer the heat to the em-shield instead of pocketing it inside it) so the aditional thermal compound outside the em-shield is to help transfer it to a even larger surface
What is the even larger surface outside the shield?
If the surface beyond the shield is the frame of the phone, then your frame should feel *warmer*, not cooler, if the heat is being transferred away from the chips.
If your phone feels cooler, then that would mean the heat is remaining within the phone, which would be bad for throttling and overall performance.
The heat doesn't just disappear, it has to go somewhere.
KingFatty said:
What is the even larger surface outside the shield?
If the surface beyond the shield is the frame of the phone, then your frame should feel *warmer*, not cooler, if the heat is being transferred away from the chips.
If your phone feels cooler, then that would mean the heat is remaining within the phone, which would be bad for throttling and overall performance.
The heat doesn't just disappear, it has to go somewhere.
Click to expand...
Click to collapse
Exactly! Listen to this guy OP! You can't just break Thermodynamics...
darioampuy said:
KUDOS for the awersome paint skills
i think lg already applied thermal compound between the processor and the em-shield (because it's logic that they transfer the heat to the em-shield instead of pocketing it inside it) so the aditional thermal compound outside the em-shield is to help transfer it to a even larger surface
Click to expand...
Click to collapse
It has some kind of sticker which goes over the CPU (there's a square cutout in the EM shield where the CPU is), which I guess is supposed to transfer heat, but it doesn't do a particularly good job of it.
KingFatty said:
What is the even larger surface outside the shield?
If the surface beyond the shield is the frame of the phone, then your frame should feel *warmer*, not cooler, if the heat is being transferred away from the chips.
If your phone feels cooler, then that would mean the heat is remaining within the phone, which would be bad for throttling and overall performance.
The heat doesn't just disappear, it has to go somewhere.
Click to expand...
Click to collapse
It doesn't dissapear, it dissipates/radiates.
That's what a heatsink does; it provides a larger surface area to increase the amount of dissipation/radiation that happens, rather than remaining where it is and accumulating.
If the heat stays where it is, it'll feel warmer within a smaller, localised area. Specifically, at the top back of the phone, where the CPU is - you'll get a larger amount of heat radiated per cm² (hence it will feel hotter), but a smaller amount of heat radiated in total due to the smaller amount of area the heat can be radiated from..
nitrous² said:
That's what I usually get. A difference of a couple thousand points has little to no significance.
Click to expand...
Click to collapse
If you're saying that it doesn't prove it made a difference in cooling, I did run the benchmark multiple times, before and after.
Based on reviewing the pictures and video, it looks like this mod will improve the heat transfer from the chips to the frame, allowing the chips to run cooler.
The images appear to miss out on putting thermal compound right over where (I think) the main CPU is. At least, if you watch the video, the guy in the video says something in a language I can't understand, and rubs his finger right around the central part and says "blah blah blah CPU" while rubbing that area (at timestamp 4:31) which makes me think that's where the CPU is located. No idea why the person adding the compound fails to put the compound right there, in the 5th spot?
You can see here, the thermal compound goes at least in the four general areas shown, interfacing between the frame and the shields. But notice the image does not put thermal paste in the fifth central location (unlike the video):
So the extra fifth area, that looks like dark tape in the image here, doesn't get any compound, unlike the video:
But compare that to the technique in the video, showing all 5 areas getting compound (this link positions the video to the 5:34 mark where you can really see all 5 spots you put the compound):
Edit: hmm not sure this website understands links with the timestamp within the url, if you use the Youtube insertion button. Here it is using the generic URL insertion:
https://youtu.be/QijWruGXqX8?t=290
See how the very first spot he puts the thermal compound is exactly where it's missing from in the Imgur album.
In the video, I think he is putting the compound on top of the tape, without removing the tape? Is that thermal tape? This might actually work better if so, because if there is tape, and you pull it off to substitute with thermal compound alone, then you won't get enough compression to make a good thermal contact. Ideally you could shim it with a copper shim and put thermal compound, but the tape+compound may be the next best thing (better than compound alone).
---------- Post added at 05:47 PM ---------- Previous post was at 05:36 PM ----------
Knowbody42 said:
It doesn't dissapear, it dissipates/radiates.
That's what a heatsink does; it provides a larger surface area to increase the amount of dissipation/radiation that happens, rather than remaining where it is and accumulating.
If the heat stays where it is, it'll feel warmer within a smaller, localised area. Specifically, at the top back of the phone, where the CPU is - you'll get a larger amount of heat radiated per cm² (hence it will feel hotter), but a smaller amount of heat radiated in total due to the smaller amount of area the heat can be radiated from..
Click to expand...
Click to collapse
In your scenario, what is acting as the heatsink that provides larger surface area?
In my scenario, the frame is the heatsink. Currently, there are inefficiencies preventing heat from transferring into the frame/heatsink. That prevents the frame/heatsink from receiving as much heat as it could under better conditions, so the frame remains cooler. By adding thermal compound, you allow better heat transfer from the chips to the frame, so the frame gets warmer. I guess because the frame is at the inner portion of the phone, away from the front or back, it would be harder to feel the heat from the frame. Because the chips run cooler, you won't feel that localized heat at the CPU as much, and the heat would be spread out throughout the inside of the phone, along a taller area. But then again, it could be moot and the phone may feel just as hot, if the chips remain at max temp due to throttling, just that the phone could perform better with the thermal compound because you could push the chips harder before it throttles.
KingFatty said:
In your scenario, what is acting as the heatsink that provides larger surface area?
In my scenario, the frame is the heatsink. Currently, there are inefficiencies preventing heat from transferring into the frame/heatsink. That prevents the frame/heatsink from receiving as much heat as it could under better conditions, so the frame remains cooler. By adding thermal compound, you allow better heat transfer from the chips to the frame, so the frame gets warmer. I guess because the frame is at the inner portion of the phone, away from the front or back, it would be harder to feel the heat from the frame. Because the chips run cooler, you won't feel that localized heat at the CPU as much, and the heat would be spread out throughout the inside of the phone, along a taller area. But then again, it could be moot and the phone may feel just as hot, if the chips remain at max temp due to throttling, just that the phone could perform better with the thermal compound because you could push the chips harder before it throttles.
Click to expand...
Click to collapse
It's using the metal frame.
I took all the the tape off, then used this in place of them:
https://www.pccasegear.com/products/32433
Unlike thermal paste, thermal pads will make up the thickness needed. That's what they're designed for.
Take the tape off, check cpu temp.
Put thermal paste on, check CPU temp.
Is there a difference?
Thanks for the youtube link to the video as I tried using LG G4 Thermal Mod and the only thing I found was for the G3. The video is in the Chinese Cantonese language. What he was saying is the CPU area needs a little dot only where the black tape is but the other areas, he doesn't really know what it's for but it wouldn't hurt to put some there. He mentions that there is a known Taiwanese video with someone using a shim instead which is better than his method. My question is if he only puts a dot in one area, wouldn't that mean that the other area where the tape is would not all make contact with the CPU. Besides, is that even the CPU because according to this in step 7, the CPU is actually below the memory:
https://www.ifixit.com/Teardown/LG+G4+Teardown/42705
The only thing with taking off the tape is it will oid the memory while if you applied the paste with the tape still there, you can basically reverse it should you need warranty on the device.
This has been done on so many devices, the first I can recall being the Nexus 4 around release time, and always turned out to be placebo at best. Unless you can provide solid evidence, with before and after data, I'm calling BS. My reasoning, among other things, goes like this:
While designing the hardware architecture of a Smartphone, a big team of hardware engineers gather and create a project. These guys have studied and worked their whole life with this. If they think there was no need for thermal compound, then I'd rather not use it.
Just look at this guy. You think you know more than him? :laugh: :laugh: ....
EDIT: I just realized, my post sounds kinda *****y and offensive. That's NOT my intention! I mean it.
nitrous² said:
This has been done on so many devices, the first I can recall being the Nexus 4 around release time, and always turned out to be placebo at best. Unless you can provide solid evidence, with before and after data, I'm calling BS. My reasoning, among other things, goes like this:
While designing the hardware architecture of a Smartphone, a big team of hardware engineers gather and create a project. These guys have studied and worked their whole life with this. If they think there was no need for thermal compound, then I'd rather not use it.
Just look at this guy. You think you know more than him? :laugh: :laugh: ....
Click to expand...
Click to collapse
You know manufacturers often leave things out to save on cost, right?
Like using cheap Chinese capacitors instead of more expensive, high quality ones that are less likely to die.
The manufacturer decides it's not worth paying more for the more optimal solution, because they figure the number of devices that die won't be that much more than the extra units sold if they have a cheaper product than their competitors.
I think that's the reason they didn't use good thermal paste or thermal pads here. Because it would cost more to add them, and is unlikely to get them any more sales. It's not about who knows more.
Hey guys, I'm the YouTube video owner and is considering if there is necessity to add English CC subtitles for more people to understand what I did and why.
Firstly, the language I spoke in the video is Cantonese(Hong Kong).
- What I did is just a trial version of thermal mod, there is better version from a Taiwanese, he could even take off the metal shield which I apply the compound on it
- There were testings for applying thermal compound on desktop PC, one spot could perform better than a thin layer because a compressed spot gives thinnest layer. A full coverage of thin layer is already too thick for thermal conduction(the thinner the better). This theory might not apply on G4 since we're not putting a heatsink on the CPU and don't have that much of force acting on it. Therefore I was just trying and might have further test on it
- Thermal pad could be added on the opposite side of the motherboard to transfer heat to the phone frame more quickly. I'll have further test on it once I can get some thermal pads
- The phone body temperature get hotter in my test with respect to the feeling of my hands, the CPU had less throttle down and the phone got less lag when playing games with slimport cable connected
(My personal opinion) The manufacturers might consider
When the phone don't have the problem of overheat(99% of the user won't face lagging due to overheat and throttle down except the one who use slimport to record gaming videos like me)
- Better thermal conduction = warmer phone body = customer think the phone is hot and bad(not optimized)
- Less material = lower cost = lower price = more competitive
There should be some wording mistakes since English isn't my native tongue
LKNim said:
Hey guys, I'm the YouTube video owner and is considering if there is necessity to add English CC subtitles for more people to understand what I did and why.
Firstly, the language I spoke in the video is Cantonese(Hong Kong).
- What I did is just a trial version of thermal mod, there is better version from a Taiwanese, he could even take off the metal shield which I apply the compound on it
- There were testings for applying thermal compound on desktop PC, one spot could perform better than a thin layer because a compressed spot gives thinnest layer. A full coverage of thin layer is already too thick for thermal conduction(the thinner the better). This theory might not apply on G4 since we're not putting a heatsink on the CPU and don't have that much of force acting on it. Therefore I was just trying and might have further test on it
- Thermal pad could be added on the opposite side of the motherboard to transfer heat to the phone frame more quickly. I'll have further test on it once I can get some thermal pads
- The phone body temperature get hotter in my test with respect to the feeling of my hands, the CPU had less throttle down and the phone got less lag when playing games with slimport cable connected
(My personal opinion) The manufacturers might consider
When the phone don't have the problem of overheat(99% of the user won't face lagging due to overheat and throttle down except the one who use slimport to record gaming videos like me)
- Better thermal conduction = warmer phone body = customer think the phone is hot and bad(not optimized)
- Less material = lower cost = lower price = more competitive
There should be some wording mistakes since English isn't my native tongue
Click to expand...
Click to collapse
better thermal conduction to a wider surface means lower average temperature on that surface. the phone feels warmer because the heat doesn't propagate from the source (the processor) to a heatsink. with the thermal mod the wide area of the frame can take more of that heat before getting warm, and since those processors generate little heat the frame doesn't get warmer. in other phones you feel the heat irradiated from the processor directly, and because their frames are made from plastic so they can't be used as a headsink
darioampuy said:
better thermal conduction to a wider surface means lower average temperature on that surface. the phone feels warmer because the heat doesn't propagate from the source (the processor) to a heatsink. with the thermal mod the wide area of the frame can take more of that heat before getting warm, and since those processors generate little heat the frame doesn't get warmer. in other phones you feel the heat irradiated from the processor directly, and because their frames are made from plastic so they can't be used as a headsink
Click to expand...
Click to collapse
I think what I said wasn't detail enough.
Where I felt hotter is the specific area of the touch screen where the cpu located, it's actually VERY HOT(I've also flashed the CTT mod v4 to keep the cpu less throttling)
Lower average temperature only apply to constant power source
In the situation of my phone, it's average temperature before it was throttling is lower. However, the cpu will hence get more time on higher clock to consume more power and produce more heat. As a result the average power is higher. Then the average temperature depends on the speed of heat dissipation which is bad on glass and plastic.
Below I'm going to describe how the heat energy are transferred, from hotter component -> colder component
Leather cover <- interior frame <- (thermal pad not yet added) <- motherboard <<- cpu ->> metal frame -> em shield -> thermal compound -> black plastic tape -> interior frame -> outer frame/touch screen
Every components listed above are counted as the heatpipe and heatsink of the cpu, heat won't be disappeared and must be transferred through them and dissipated to the air from leather cover/plastic frame/touch screen
What my thermal mod did is to speed up the heat transfer from em shield to the plastic tape, a lower temperature em shield can absorb more heat from metal frame and hence the cpu, then the cpu get cooler
I got lots of experience of desktop computer thermal solution and realize the basic theories could apply on mobile phones too. Correct me if any of the statement was wrong