http://fashion.pconline.com.cn/mobile/1204/2754053.html
Just like the sensation the One X can function seperate from its shell
However these photos also reveal the screen is one part with the metal lining which in tern locks into the polycarbonate
the problems some people are facing is a flex between the screen and the metal frame! glue problem or do we have clips there too?
Also you can see how to replace the battery
Great news that the battery is easily replaceable, hopefully the part is available to the public either first or third-party...
Sent from my Transformer TF101 using XDA
Great to see someone has been brave.... Must have large pockets or large stones.....
Sent from my HTC One X using XDA Premium HD app
the bad news is the flex, is between the metal and screen, that's certainly a defect
i guess the glue is pooping out due to structural pressure or heat
knoxploration said:
Great news that the battery is easily replaceable, hopefully the part is available to the public either first or third-party...
Sent from my Transformer TF101 using XDA
Click to expand...
Click to collapse
Not so easy.... To change battery, have to remove mainboard (battery connector laying under)= warranty void...
jires said:
Not so easy.... To change battery, have to remove mainboard (battery connector laying under)= warranty void...
Click to expand...
Click to collapse
Your warranty is void anyway, or you wouldn't be changing the battery yourself. ;-)
the more i think about it the more i realize most of the different issues around here are coming of this particular screen defect, where the glass is pulling from the metal frame around, i thought its glue
but i tried my hardest to lock mine back and now its locked into place
so i dont think it glued back, there most be also clips in there for the screen too to clip it with the metal frame
everyone with the flex issue should shut down the phone and try to lock it back
If I put quite a lot of pressure on mine it does stop it from creaking for a short while but it soon comes back.
I've noticed the creaking is worse when the device is cold too. For obvious reasons I guess
DaveDesire said:
If I put quite a lot of pressure on mine it does stop it from creaking for a short while but it soon comes back.
I've noticed the creaking is worse when the device is cold too. For obvious reasons I guess
Click to expand...
Click to collapse
yes but im trying it now the more i apply pressure the more it becomes rigid, the gap is almost gone too
try around the whole rim and not just the affected area with the device turned off (no fast boot)
That big sheet of copper is for heat spread. Just so you know where all those heat is coming from. Apparently it needs a copper sheet to spread the heat about.
Just saying, for those who dont know yet. My chinese is horrible. That is about the only thing I can roughly understand.
townay said:
That big sheet of copper is for heat spread. Just so you know where all those heat is coming from. Apparently it needs a copper sheet to spread the heat about.
Just saying, for those who dont know yet. My chinese is horrible. That is about the only thing I can roughly understand.
Click to expand...
Click to collapse
Automatic google translate helps a lot.
townay said:
That big sheet of copper is for heat spread. Just so you know where all those heat is coming from. Apparently it needs a copper sheet to spread the heat about.
Just saying, for those who dont know yet. My chinese is horrible. That is about the only thing I can roughly understand.
Click to expand...
Click to collapse
thanks man, can you translate how the screen clips in?
auto translate won't work, its written on the image
Just what we did not need a great big hot copper sheet attached to the battery, heat kills battery`s
John.
Tinderbox (UK) said:
Just what we did not need a great big hot copper sheet attached to the battery, heat kills battery`s
John.
Click to expand...
Click to collapse
still the device is a marvel, surely they have tested
actually whats aggravating the heat is the charging and wifi, tegra3 on its own is fine
Tested, COME ON! , have you see all the faults/features they barley test anything nowadays, and i still love my HOX
John.
hamdir said:
still the device is a marvel, surely they have tested
actually whats aggravating the heat is the charging and wifi, tegra3 on its own is fine
Click to expand...
Click to collapse
I wonder where's the 32gb storage....
hamdir said:
thanks man, can you translate how the screen clips in?
auto translate won't work, its written on the image
Click to expand...
Click to collapse
Sorry, I cant. Even though I am Taiwanese, I've been studying English overseas since young. My Chinese is absolutely horrible
Tinderbox (UK) said:
Just what we did not need a great big hot copper sheet attached to the battery, heat kills battery`s
Click to expand...
Click to collapse
That copper will be transferring heat away from hotter areas, and towards cooler ones. The battery will be one of the hotter areas.
Also, it's likely there for RF shielding to some degree.
Tinderbox (UK) said:
Just what we did not need a great big hot copper sheet attached to the battery, heat kills battery`s
John.
Click to expand...
Click to collapse
This explains why my phone won't charge at the same time as running something processor and graphically intensive.
It says...
"The opposite of taking it apart. As you put the phone back together, push the top area into the calycarbonate casing first then slowly work your way down the sides into the casing. The putback process was similiar to the Sensation, however the One X design may be for making the device more compact and thinner."
hamdir said:
thanks man, can you translate how the screen clips in?
auto translate won't work, its written on the image
Click to expand...
Click to collapse
I recall reading on forums that someone did a LG G4 Thermal Compound mod, did it help with the temperatures? Does anyone have a link to the youtube video for it? This is the only thing I can find when searching:
http://imgur.com/a/P5BtT
Interesting. Looks pretty straight forward, though I wonder about the difference in thickness between thermal tape and grease, I think it would be pretty easy to do. Although, you'd have to replace the thermal pad if the grease wasn't as effective
The Snapdragon CPU is underneath the tape they put on. It doesn't conduct heat very well.
I bought some Alphacool Eisschicht 0.5mm 14W/mK thermal pads, and cut out a square for the CPU. It seems to have significantly reduced the amount of heat I can feel when doing demanding things.
I think it's also responsible for an increased score in Antutu, due to less throttling (I just got a score of 50834, up from around 46-47k)
Is this a joke? How is putting thermal paste onto EM-Shielding going to help dissipate heat?! If anything, it'll isolate and therefore the phone won't "feel" that warm anymore but may infact operate warmer than ususal due to it. Thermal compounds are meant to be used to "conduct" heat to a heatsink by, and this is important, filling out irregularities on the heat source's and heatsink's surface. Without it, the irregularities are filled with air and we all know air is not goog at conducting kinetic energy. Thermal compound has no cooling properties!
Knowbody42 said:
(...) I think it's also responsible for an increased score in Antutu, due to less throttling (I just got a score of 50834, up from around 46-47k)
Click to expand...
Click to collapse
That's what I usually get. A difference of a couple thousand points has little to no significance.
nitrous² said:
Is this a joke? How is putting thermal paste onto EM-Shielding going to help dissipate heat?! If anything, it'll isolate and therefore the phone won't "feel" that warm anymore but may infact operate warmer than ususal due to it. Thermal compounds are meant to be used to "conduct" heat to a heatsink by, and this is important, filling out irregularities on the heat source's and heatsink's surface. Without it, the irregularities are filled with air and we all know air is not goog at conducting kinetic energy. Thermal compound has no cooling properties!
That's what I usually get. A difference of a couple thousand points has little to no significance.
Click to expand...
Click to collapse
a heatsink is a piece of heat conductive element that has a bigger surface compared to the object it want to dissipate heat from. the EM shield has that bigger surface compared to the processor so it's a candidate for heatsink. the thermal compound is used to transfer the heat from the processor to the heatsink. in the theory the mod is solid.
Almighty1 said:
I recall reading on forums that someone did a LG G4 Thermal Compound mod, did it help with the temperatures? Does anyone have a link to the youtube video for it? This is the only thing I can find when searching:
http://imgur.com/a/P5BtT
Click to expand...
Click to collapse
here's the video
https://www.youtube.com/watch?v=QijWruGXqX8
darioampuy said:
a heatsink is a piece of heat conductive element that has a bigger surface compared to the object it want to dissipate heat from. the EM shield has that bigger surface compared to the processor so it's a candidate for heatsink. the thermal compound is used to transfer the heat from the processor to the heatsink. in the theory the mod is solid.
Click to expand...
Click to collapse
Of course, not denying that. Apart from what a heatsink is, you have to know how a heatsink works.
Let's just forget for a second that EM-Shields are not meant to be used as heatsinks. How is putting thermal paste ontop of the EM-Shielding logical in any way? Heat from the IC's on the logic board will dissipate heat to the EM-Shielding. It's going to help a little with cooling, but not significantly. What you do now is, you isolate the EM-Shielding with Thermal compound causing heat to build up even more underneath it. Since you isolated so good, you won't feel the phone heating up so much in your hand. Have you ever built a pc? I do that for a living. It's like putting thermal compound ontop of your heatsink instead of in between CPU and Heatsink. Please look at this majestic MS Paint graphic I just made. I hope it helps to understand how thermal compound works, and is meant to be used. I may not be a professional and I'm asking to be corrected! Seriously. But I'm also positive that OP's method is not how you work with thermal compound.
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nitrous² said:
Of course, not denying that. Apart from what a heatsink is, you have to know how a heatsink works.
Let's just forget for a second that EM-Shields are not meant to be used as heatsinks. How is putting thermal paste ontop of the EM-Shielding logical in any way? Heat from the IC's on the logic board will dissipate heat to the EM-Shielding. It's going to help a little with cooling, but not significantly. What you do now is, you isolate the EM-Shielding with Thermal compound causing heat to build up even more underneath it. Since you isolated so good, you won't feel the phone heating up so much in your hand. Have you ever built a pc? I do that for a living. It's like putting thermal compound ontop of your heatsink instead of in between CPU and Heatsink. Please look at this majestic MS Paint graphic I just made. I hope it helps to understand how thermal compound works, and is meant to be used. I may not be a professional and I'm asking to be corrected! Seriously. But I'm also positive that OP's method is not how you work with thermal compound.
Click to expand...
Click to collapse
KUDOS for the awersome paint skills
i think lg already applied thermal compound between the processor and the em-shield (because it's logic that they transfer the heat to the em-shield instead of pocketing it inside it) so the aditional thermal compound outside the em-shield is to help transfer it to a even larger surface
What is the even larger surface outside the shield?
If the surface beyond the shield is the frame of the phone, then your frame should feel *warmer*, not cooler, if the heat is being transferred away from the chips.
If your phone feels cooler, then that would mean the heat is remaining within the phone, which would be bad for throttling and overall performance.
The heat doesn't just disappear, it has to go somewhere.
KingFatty said:
What is the even larger surface outside the shield?
If the surface beyond the shield is the frame of the phone, then your frame should feel *warmer*, not cooler, if the heat is being transferred away from the chips.
If your phone feels cooler, then that would mean the heat is remaining within the phone, which would be bad for throttling and overall performance.
The heat doesn't just disappear, it has to go somewhere.
Click to expand...
Click to collapse
Exactly! Listen to this guy OP! You can't just break Thermodynamics...
darioampuy said:
KUDOS for the awersome paint skills
i think lg already applied thermal compound between the processor and the em-shield (because it's logic that they transfer the heat to the em-shield instead of pocketing it inside it) so the aditional thermal compound outside the em-shield is to help transfer it to a even larger surface
Click to expand...
Click to collapse
It has some kind of sticker which goes over the CPU (there's a square cutout in the EM shield where the CPU is), which I guess is supposed to transfer heat, but it doesn't do a particularly good job of it.
KingFatty said:
What is the even larger surface outside the shield?
If the surface beyond the shield is the frame of the phone, then your frame should feel *warmer*, not cooler, if the heat is being transferred away from the chips.
If your phone feels cooler, then that would mean the heat is remaining within the phone, which would be bad for throttling and overall performance.
The heat doesn't just disappear, it has to go somewhere.
Click to expand...
Click to collapse
It doesn't dissapear, it dissipates/radiates.
That's what a heatsink does; it provides a larger surface area to increase the amount of dissipation/radiation that happens, rather than remaining where it is and accumulating.
If the heat stays where it is, it'll feel warmer within a smaller, localised area. Specifically, at the top back of the phone, where the CPU is - you'll get a larger amount of heat radiated per cm² (hence it will feel hotter), but a smaller amount of heat radiated in total due to the smaller amount of area the heat can be radiated from..
nitrous² said:
That's what I usually get. A difference of a couple thousand points has little to no significance.
Click to expand...
Click to collapse
If you're saying that it doesn't prove it made a difference in cooling, I did run the benchmark multiple times, before and after.
Based on reviewing the pictures and video, it looks like this mod will improve the heat transfer from the chips to the frame, allowing the chips to run cooler.
The images appear to miss out on putting thermal compound right over where (I think) the main CPU is. At least, if you watch the video, the guy in the video says something in a language I can't understand, and rubs his finger right around the central part and says "blah blah blah CPU" while rubbing that area (at timestamp 4:31) which makes me think that's where the CPU is located. No idea why the person adding the compound fails to put the compound right there, in the 5th spot?
You can see here, the thermal compound goes at least in the four general areas shown, interfacing between the frame and the shields. But notice the image does not put thermal paste in the fifth central location (unlike the video):
So the extra fifth area, that looks like dark tape in the image here, doesn't get any compound, unlike the video:
But compare that to the technique in the video, showing all 5 areas getting compound (this link positions the video to the 5:34 mark where you can really see all 5 spots you put the compound):
Edit: hmm not sure this website understands links with the timestamp within the url, if you use the Youtube insertion button. Here it is using the generic URL insertion:
https://youtu.be/QijWruGXqX8?t=290
See how the very first spot he puts the thermal compound is exactly where it's missing from in the Imgur album.
In the video, I think he is putting the compound on top of the tape, without removing the tape? Is that thermal tape? This might actually work better if so, because if there is tape, and you pull it off to substitute with thermal compound alone, then you won't get enough compression to make a good thermal contact. Ideally you could shim it with a copper shim and put thermal compound, but the tape+compound may be the next best thing (better than compound alone).
---------- Post added at 05:47 PM ---------- Previous post was at 05:36 PM ----------
Knowbody42 said:
It doesn't dissapear, it dissipates/radiates.
That's what a heatsink does; it provides a larger surface area to increase the amount of dissipation/radiation that happens, rather than remaining where it is and accumulating.
If the heat stays where it is, it'll feel warmer within a smaller, localised area. Specifically, at the top back of the phone, where the CPU is - you'll get a larger amount of heat radiated per cm² (hence it will feel hotter), but a smaller amount of heat radiated in total due to the smaller amount of area the heat can be radiated from..
Click to expand...
Click to collapse
In your scenario, what is acting as the heatsink that provides larger surface area?
In my scenario, the frame is the heatsink. Currently, there are inefficiencies preventing heat from transferring into the frame/heatsink. That prevents the frame/heatsink from receiving as much heat as it could under better conditions, so the frame remains cooler. By adding thermal compound, you allow better heat transfer from the chips to the frame, so the frame gets warmer. I guess because the frame is at the inner portion of the phone, away from the front or back, it would be harder to feel the heat from the frame. Because the chips run cooler, you won't feel that localized heat at the CPU as much, and the heat would be spread out throughout the inside of the phone, along a taller area. But then again, it could be moot and the phone may feel just as hot, if the chips remain at max temp due to throttling, just that the phone could perform better with the thermal compound because you could push the chips harder before it throttles.
KingFatty said:
In your scenario, what is acting as the heatsink that provides larger surface area?
In my scenario, the frame is the heatsink. Currently, there are inefficiencies preventing heat from transferring into the frame/heatsink. That prevents the frame/heatsink from receiving as much heat as it could under better conditions, so the frame remains cooler. By adding thermal compound, you allow better heat transfer from the chips to the frame, so the frame gets warmer. I guess because the frame is at the inner portion of the phone, away from the front or back, it would be harder to feel the heat from the frame. Because the chips run cooler, you won't feel that localized heat at the CPU as much, and the heat would be spread out throughout the inside of the phone, along a taller area. But then again, it could be moot and the phone may feel just as hot, if the chips remain at max temp due to throttling, just that the phone could perform better with the thermal compound because you could push the chips harder before it throttles.
Click to expand...
Click to collapse
It's using the metal frame.
I took all the the tape off, then used this in place of them:
https://www.pccasegear.com/products/32433
Unlike thermal paste, thermal pads will make up the thickness needed. That's what they're designed for.
Take the tape off, check cpu temp.
Put thermal paste on, check CPU temp.
Is there a difference?
Thanks for the youtube link to the video as I tried using LG G4 Thermal Mod and the only thing I found was for the G3. The video is in the Chinese Cantonese language. What he was saying is the CPU area needs a little dot only where the black tape is but the other areas, he doesn't really know what it's for but it wouldn't hurt to put some there. He mentions that there is a known Taiwanese video with someone using a shim instead which is better than his method. My question is if he only puts a dot in one area, wouldn't that mean that the other area where the tape is would not all make contact with the CPU. Besides, is that even the CPU because according to this in step 7, the CPU is actually below the memory:
https://www.ifixit.com/Teardown/LG+G4+Teardown/42705
The only thing with taking off the tape is it will oid the memory while if you applied the paste with the tape still there, you can basically reverse it should you need warranty on the device.
This has been done on so many devices, the first I can recall being the Nexus 4 around release time, and always turned out to be placebo at best. Unless you can provide solid evidence, with before and after data, I'm calling BS. My reasoning, among other things, goes like this:
While designing the hardware architecture of a Smartphone, a big team of hardware engineers gather and create a project. These guys have studied and worked their whole life with this. If they think there was no need for thermal compound, then I'd rather not use it.
Just look at this guy. You think you know more than him? :laugh: :laugh: ....
EDIT: I just realized, my post sounds kinda *****y and offensive. That's NOT my intention! I mean it.
nitrous² said:
This has been done on so many devices, the first I can recall being the Nexus 4 around release time, and always turned out to be placebo at best. Unless you can provide solid evidence, with before and after data, I'm calling BS. My reasoning, among other things, goes like this:
While designing the hardware architecture of a Smartphone, a big team of hardware engineers gather and create a project. These guys have studied and worked their whole life with this. If they think there was no need for thermal compound, then I'd rather not use it.
Just look at this guy. You think you know more than him? :laugh: :laugh: ....
Click to expand...
Click to collapse
You know manufacturers often leave things out to save on cost, right?
Like using cheap Chinese capacitors instead of more expensive, high quality ones that are less likely to die.
The manufacturer decides it's not worth paying more for the more optimal solution, because they figure the number of devices that die won't be that much more than the extra units sold if they have a cheaper product than their competitors.
I think that's the reason they didn't use good thermal paste or thermal pads here. Because it would cost more to add them, and is unlikely to get them any more sales. It's not about who knows more.
Hey guys, I'm the YouTube video owner and is considering if there is necessity to add English CC subtitles for more people to understand what I did and why.
Firstly, the language I spoke in the video is Cantonese(Hong Kong).
- What I did is just a trial version of thermal mod, there is better version from a Taiwanese, he could even take off the metal shield which I apply the compound on it
- There were testings for applying thermal compound on desktop PC, one spot could perform better than a thin layer because a compressed spot gives thinnest layer. A full coverage of thin layer is already too thick for thermal conduction(the thinner the better). This theory might not apply on G4 since we're not putting a heatsink on the CPU and don't have that much of force acting on it. Therefore I was just trying and might have further test on it
- Thermal pad could be added on the opposite side of the motherboard to transfer heat to the phone frame more quickly. I'll have further test on it once I can get some thermal pads
- The phone body temperature get hotter in my test with respect to the feeling of my hands, the CPU had less throttle down and the phone got less lag when playing games with slimport cable connected
(My personal opinion) The manufacturers might consider
When the phone don't have the problem of overheat(99% of the user won't face lagging due to overheat and throttle down except the one who use slimport to record gaming videos like me)
- Better thermal conduction = warmer phone body = customer think the phone is hot and bad(not optimized)
- Less material = lower cost = lower price = more competitive
There should be some wording mistakes since English isn't my native tongue
LKNim said:
Hey guys, I'm the YouTube video owner and is considering if there is necessity to add English CC subtitles for more people to understand what I did and why.
Firstly, the language I spoke in the video is Cantonese(Hong Kong).
- What I did is just a trial version of thermal mod, there is better version from a Taiwanese, he could even take off the metal shield which I apply the compound on it
- There were testings for applying thermal compound on desktop PC, one spot could perform better than a thin layer because a compressed spot gives thinnest layer. A full coverage of thin layer is already too thick for thermal conduction(the thinner the better). This theory might not apply on G4 since we're not putting a heatsink on the CPU and don't have that much of force acting on it. Therefore I was just trying and might have further test on it
- Thermal pad could be added on the opposite side of the motherboard to transfer heat to the phone frame more quickly. I'll have further test on it once I can get some thermal pads
- The phone body temperature get hotter in my test with respect to the feeling of my hands, the CPU had less throttle down and the phone got less lag when playing games with slimport cable connected
(My personal opinion) The manufacturers might consider
When the phone don't have the problem of overheat(99% of the user won't face lagging due to overheat and throttle down except the one who use slimport to record gaming videos like me)
- Better thermal conduction = warmer phone body = customer think the phone is hot and bad(not optimized)
- Less material = lower cost = lower price = more competitive
There should be some wording mistakes since English isn't my native tongue
Click to expand...
Click to collapse
better thermal conduction to a wider surface means lower average temperature on that surface. the phone feels warmer because the heat doesn't propagate from the source (the processor) to a heatsink. with the thermal mod the wide area of the frame can take more of that heat before getting warm, and since those processors generate little heat the frame doesn't get warmer. in other phones you feel the heat irradiated from the processor directly, and because their frames are made from plastic so they can't be used as a headsink
darioampuy said:
better thermal conduction to a wider surface means lower average temperature on that surface. the phone feels warmer because the heat doesn't propagate from the source (the processor) to a heatsink. with the thermal mod the wide area of the frame can take more of that heat before getting warm, and since those processors generate little heat the frame doesn't get warmer. in other phones you feel the heat irradiated from the processor directly, and because their frames are made from plastic so they can't be used as a headsink
Click to expand...
Click to collapse
I think what I said wasn't detail enough.
Where I felt hotter is the specific area of the touch screen where the cpu located, it's actually VERY HOT(I've also flashed the CTT mod v4 to keep the cpu less throttling)
Lower average temperature only apply to constant power source
In the situation of my phone, it's average temperature before it was throttling is lower. However, the cpu will hence get more time on higher clock to consume more power and produce more heat. As a result the average power is higher. Then the average temperature depends on the speed of heat dissipation which is bad on glass and plastic.
Below I'm going to describe how the heat energy are transferred, from hotter component -> colder component
Leather cover <- interior frame <- (thermal pad not yet added) <- motherboard <<- cpu ->> metal frame -> em shield -> thermal compound -> black plastic tape -> interior frame -> outer frame/touch screen
Every components listed above are counted as the heatpipe and heatsink of the cpu, heat won't be disappeared and must be transferred through them and dissipated to the air from leather cover/plastic frame/touch screen
What my thermal mod did is to speed up the heat transfer from em shield to the plastic tape, a lower temperature em shield can absorb more heat from metal frame and hence the cpu, then the cpu get cooler
I got lots of experience of desktop computer thermal solution and realize the basic theories could apply on mobile phones too. Correct me if any of the statement was wrong
Hi all,
I just made a pretty weird discovery with my 5x. I was having issues with heat and poor performance over the past few months, and opened up the phone after having a boot loop issue (I resolved it after this). To try to lower temperatures, I put a very small amount of thermal paste (enough to cover the chip) over the RAM chip (it covers the snapdragon 808 that resides underneath it) underneath the metal shielding. After doing so, apps like Snapchat ran significantly faster and cooler. Has anyone else tried anything similar and had results like this??? If so, please let me know!
danamon2002 said:
Hi all,
I just made a pretty weird discovery with my 5x. I was having issues with heat and poor performance over the past few months, and opened up the phone after having a boot loop issue (I resolved it after this). To try to lower temperatures, I put a very small amount of thermal paste (enough to cover the chip) over the RAM chip (it covers the snapdragon 808 that resides underneath it) underneath the metal shielding. After doing so, apps like Snapchat ran significantly faster and cooler. Has anyone else tried anything similar and had results like this??? If so, please let me know!
Click to expand...
Click to collapse
Does toothpaste work? I ran out of thermal paste and it says it cools
batwingnz said:
Does toothpaste work? I ran out of thermal paste and it says it cools
Click to expand...
Click to collapse
Don't try it!!! It could dry up and become crusty, or even worse, be conductive and cause a short circuit, damaging the phone.
I considered this, but it makes it so obvious that you've opened it up, I didn't since they extended the warranty. If I was beyond it for sure, I would. I'm beyond the 12 months, but not the 18 months, which my replacement device should theoretically fall into. I also briefly thought about slapping some on top of the metal cover and having the outer plastic cover mash it down to transfer more heat to the cover.
Also, when I took my prior 5X apart, I noticed the thin cover over the chips wasn't actually all metal. Over the big chip(s) it was actually a woven material or maybe made some other way. You can see through that part a bit if held up to the light. But it looked like metal so perhaps was metalic. The rest is metal. So I wonder if the thermal paste is actually transferring it to the metal. It seems like the semi translucent material is intended to let the heat out through it versus taking the heat itself. But thermal paste is going to take some heat away itself and maybe transfer it to the metal.
Though someone posted a picture of the board on another thread, and that one has a black cover instead of the silver version. Maybe it is all metal on newer production runs.
Could you send cpu-z screenshots of the temperatures at idle?
javiman14 said:
Could you send cpu-z screenshots of the temperatures at idle?
Click to expand...
Click to collapse
I'd love to, but my device fell into a bootloop and now i have the 4 cores patch on it so the temperatures wouldn't be accurate.
Yes, there is a performance boost, because the big cluster isn't thermal throttling so fast as always do, and neither gains temperature so fast.
I did a thread when i did it to my N5x, and i took some pictures.
See here.
What is this black pad? it doesn't touch the cpu which is notorious for overheating.
Its like a cushion and its feels like rubber.
I wanted to apply some thermal paste, but that black rubber pad is there.
James101 said:
What is this black pad? it doesn't touch the cpu which is notorious for overheating.
Its like a cushion and its feels like rubber.
I wanted to apply some thermal paste, but that black rubber pad is there.
Click to expand...
Click to collapse
Maybe a thermal pad?
My advice: search a little more about that (use of thermal paste), and only if you find solid proof that it works, than do it.
Compare the number on this video: https://www.youtube.com/watch?v=QijWruGXqX8 (turn on subtitles) and see if there is a considerable or any difference.
Your phone...
Put thermal paste on mine last week and its been running mutch cooler and i dont burn my hand after using it.
idle 32c(from 38) and maxed out 70c(from 80+) after 20min game test, but dropped instantly when closing. Didnt bother thinking about that pad as the paste isnt conductive..
Make sure you put paste directly on the cpu's as well as there isnt any.(under the thin metal cover on motherboard, carefully lift it up with a knife or thin object)
then apply a few dots on the metal around the black pad.
I open mine to take a better look and to be honest it looks just like paint. No softer/harder material than the rest, didn't saw any corner or edge that I could use to take out...
RuedasLocas said:
I open mine to take a better look and to be honest it looks just like paint. No softer/harder material than the rest, didn't saw any corner or edge that I could use to take out...
Click to expand...
Click to collapse
How weird, mine is definitely rubbery with 2 holes that hold it down. I could lift the corners. But I didn't, I didn't know if there was anything back there to do with the Lcd. So I thought I would ask here first before I go messing with something that I'm unfamiliar with.
Look at the picture below, there's an indentation for the cpu, clearly its there to not touch the cpu. The cpu sits low, slightly beneath the metal shield and is covered by some type of fabric heat tape.
I'm guess the black pad is there to block the heat from reach the lcd?
I went all crazy and spread the heat out. With thermal pads & paste on both sides.
James101 said:
How weird, mine is definitely rubbery with 2 holes that hold it down. I could lift the corners. But I didn't, I didn't know if there was anything back there to do with the Lcd. So I thought I would ask here first before I go messing with something that I'm unfamiliar with.
Look at the picture below, there's an indentation for the cpu, clearly its there to not touch the cpu. The cpu sits low, slightly beneath the metal shield and is covered by some type of fabric heat tape.
I'm guess the black pad is there to block the heat from reach the lcd?
Click to expand...
Click to collapse
Maybe, or the RAM...
Take a look here ( https://www.ifixit.com/Teardown/LG+G4+Teardown/42705 ) to know better about internal parts. Might be handy.